M2S050T-FG896

Microsemi Corporation

RoHS

Package 896-BGA

Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)

Description FPGA SmartFusion2 Family 48672 Cells 65nm (CMOS) Technology 1.2V 896-Pin FBGA

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Inventory: 8970

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Technical Details

Supply Chain

Factory Lead Time 5 Weeks

Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)

Physical

Package / Case 896-BGA

Supplier Device Package 896-FBGA (31x31)

Technical

Operating Temperature 0°C~85°C TJ

Packaging Tray

Published 2015

Series SmartFusion?2

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Max Operating Temperature 85°C

Min Operating Temperature 0°C

Base Part Number M2S050

Operating Supply Voltage 1.2V

Memory Size 256kB

Number of I/O 377

Speed 166MHz

RAM Size 64KB

Core Processor ARM? Cortex?-M3

Peripherals DDR, PCIe, SERDES

Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB

Data Rate 667 Mbps

Architecture MCU, FPGA

Number of Logic Elements/Cells 56340

Max Frequency 400MHz

Number of Logic Blocks (LABs) 4695

Primary Attributes FPGA - 50K Logic Modules

Flash Size 256KB

Compliance

RoHS Status Non-RoHS Compliant

Lead Free Contains Lead

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