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SIDC30D120H8X1SA4

Infineon Technologies
RoHS
RoHS RoHS compliant
Package Die
Category Discrete Semiconductor Products / Diodes - Rectifiers - Single
Description DIODE GEN PURP 1.2KV 50A WAFER
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case Die
Surface Mount YES
Diode Element Material SILICON

Technical

Packaging Bulk
Published 2010
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 1
ECCN Code EAR99
HTS Code 8541.10.00.40
Terminal Position UPPER
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-XUUC-N1
Operating Temperature (Max) 175°C
Number of Elements 1
Configuration SINGLE
Speed Standard Recovery >500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 27μA @ 1200V
Voltage - Forward (Vf) (Max) @ If 1.97V @ 50A
Operating Temperature - Junction -40°C~175°C
Application FAST SOFT RECOVERY
Halogen Free Halogen Free
Voltage - DC Reverse (Vr) (Max) 1200V
Current - Average Rectified (Io) 50A DC
Drain to Source Voltage (Vdss) 1.2kV
Number of Phases 1
Rep Pk Reverse Voltage-Max 1200V
Max Dual Supply Voltage 1.2kV
Reverse Current-Max 27μA

Compliance

RoHS Status ROHS3 Compliant
Lead Free Lead Free

Alternative Model

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